Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11430753 | Iterative formation of damascene interconnects | Eric R. Miller, Michael V. Liguori, Michael J. Rondon | 2022-08-30 |
| 11393869 | Wafer level shim processing | Jeffery H. Burkhart, Eric R. Miller | 2022-07-19 |
| 11222813 | Method of manufacturing wafer level low melting temperature interconnections | Eric R. Miller, George Grama | 2022-01-11 |