Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11410937 | Semiconductor device with aluminum nitride anti-deflection layer | Andrew Clarke, Michael J. Rondon | 2022-08-09 |
| 11222813 | Method of manufacturing wafer level low melting temperature interconnections | Sean P. Kilcoyne, Eric R. Miller | 2022-01-11 |