Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11374136 | Semiconductor package and forming method thereof | Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chih-Hao Chang, Chia-Hung Liu +2 more | 2022-06-28 |
PL
Po-Chun Lin
Overall (2022): #298,711 of 548,613Top 55%
1
Patents 2022