Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11510315 | Multilayer substrate, interposer, and electronic device | Hiromasa KOYAMA, Atsushi Kasuya | 2022-11-22 |
| 11445606 | Laminated body and method for manufacturing the same | Yusuke Kamitsubo, Tsuyoshi Katsube | 2022-09-13 |
| 11266016 | Resin multilayer substrate and electronic apparatus | Yusuke Kamitsubo, Tsuyoshi Katsube, Yasuhiro Kuratani, Shigeru Tago, Tomohiro FURUMURA | 2022-03-01 |
| 11257779 | Multilayer wiring board, electronic device and method for producing multilayer wiring board | Toshitaka HAYASHI, Hiromasa KOYAMA | 2022-02-22 |