Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11510315 | Multilayer substrate, interposer, and electronic device | Ryosuke TAKADA, Atsushi Kasuya | 2022-11-22 |
| 11387016 | Transmission line substrate and electronic device | Takahiro Baba, Lijun Zhao, Chu Xu, Satoshi Matsuura | 2022-07-12 |
| 11257779 | Multilayer wiring board, electronic device and method for producing multilayer wiring board | Ryosuke TAKADA, Toshitaka HAYASHI | 2022-02-22 |
| 11259401 | Resin multilayer substrate, electronic component, and mounting structure thereof | — | 2022-02-22 |
| 11224119 | Resin multilayer substrate, electronic component, and mounting structure thereof | — | 2022-01-11 |