Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11510315 | Multilayer substrate, interposer, and electronic device | Hiromasa KOYAMA, Ryosuke TAKADA | 2022-11-22 |
| 11406013 | Resin multilayer substrate and electronic device | — | 2022-08-02 |