Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11419210 | Resin composition, metal foil provided with resin layer, metal clad laminate, and printed wiring board | Tetsuro Sato | 2022-08-16 |
| 11310910 | Resin composition, copper foil with resin, dielectric layer, copper clad laminate sheet, capacitor element and printed wiring board with built-in capacitor | Yoshihiro Yoneda, Toshihiro Hosoi, Kenshiro FUKUDA | 2022-04-19 |