Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11310910 | Resin composition, copper foil with resin, dielectric layer, copper clad laminate sheet, capacitor element and printed wiring board with built-in capacitor | Yoshihiro Yoneda, Toshifumi Matsushima, Toshihiro Hosoi | 2022-04-19 |