Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11525073 | Multilayer circuit board manufacturing method | Yoshinori Matsuura, Toshimi Nakamura, Takenori Yanai | 2022-12-13 |
| 11527415 | Multilayer circuit board manufacturing method | Yoshinori Matsuura, Takenori Yanai, Toshimi Nakamura | 2022-12-13 |
| 11458400 | Information processing device, information processing method, and program for generating an added related to a predicted future behavior | — | 2022-10-04 |
| 11419210 | Resin composition, metal foil provided with resin layer, metal clad laminate, and printed wiring board | Toshifumi Matsushima | 2022-08-16 |