Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11525073 | Multilayer circuit board manufacturing method | Tetsuro Sato, Toshimi Nakamura, Takenori Yanai | 2022-12-13 |
| 11527415 | Multilayer circuit board manufacturing method | Tetsuro Sato, Takenori Yanai, Toshimi Nakamura | 2022-12-13 |
| 11317522 | Wiring board manufacturing method | Toshimi Nakamura | 2022-04-26 |