Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521869 | Reduced footprint platform architecture with linear vacuum transfer module | Richard M. Blank | 2022-12-06 |
| 11393705 | Wafer transport assembly with integrated buffers | John Daugherty, David Trussell, Michael C. Kellogg, Christopher Pena, Klay Kunkel | 2022-07-19 |