Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508668 | Semiconductor package structure and method for manufacturing the same | Cheng-Yuan KUNG, Hung-Yi Lin, Meng-Wei Hsieh | 2022-11-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508668 | Semiconductor package structure and method for manufacturing the same | Cheng-Yuan KUNG, Hung-Yi Lin, Meng-Wei Hsieh | 2022-11-22 |