Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11335719 | Semiconductor package including an image sensor chip and a method of fabricating the same | Chungsun Lee, Yoonha Jung, Chajea Jo | 2022-05-17 |
| 11328966 | Chip-stacked semiconductor package and method of manufacturing same | Hyoeun Kim, Sunkyoung Seo, Seunghoon Yeon, Sanguk Han | 2022-05-10 |
| 11244894 | Semiconductor packages | Seunghoon Yeon, Wonil Lee | 2022-02-08 |