Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508678 | Semiconductor package structure including antenna | Nai-Wei Liu, Tzu-Hung Lin | 2022-11-22 |
| 11450606 | Chip scale package structure and method of forming the same | Nai-Wei Liu, Tzu-Hung Lin, Ta-Jen Yu, Wen-Sung Hsu | 2022-09-20 |