Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11264301 | System and method to enhance reliability in connection with arrangements including circuits | Lee Kong Yu, Sungjun Im, Chun Sean Lau, Yoong Tatt Chin, Paramjeet Singh Gill | 2022-03-01 |
| 11251150 | High density substrate routing in package | Chia-Pin Chiu | 2022-02-15 |