Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11284502 | Thermal relief for through-hole and surface mounting | Choon Kuai Lee, Ing Chyuan Ooi | 2022-03-22 |
| 11264301 | System and method to enhance reliability in connection with arrangements including circuits | Lee Kong Yu, Sungjun Im, Yoong Tatt Chin, Paramjeet Singh Gill, Weng Hong Teh | 2022-03-01 |