Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11284502 | Thermal relief for through-hole and surface mounting | Chun Sean Lau, Ing Chyuan Ooi | 2022-03-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11284502 | Thermal relief for through-hole and surface mounting | Chun Sean Lau, Ing Chyuan Ooi | 2022-03-22 |