Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11251160 | Manufacturing of flip-chip electronic device with carrier having heat dissipation elements free of solder mask | Stefano S. Oggioni, Gerd Schlottig | 2022-02-15 |
| 11235404 | Personalized copper block for selective solder removal | Charles L. Arvin, Luca Del Carro, Thomas Weiss, Chris Muzzy | 2022-02-01 |