Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11309207 | Grounding mechanism for multi-layer for electrostatic chuck, and related methods | Jakub Rybczynski, Chun Wang Chan, Yan Liu | 2022-04-19 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11309207 | Grounding mechanism for multi-layer for electrostatic chuck, and related methods | Jakub Rybczynski, Chun Wang Chan, Yan Liu | 2022-04-19 |