Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11417557 | Spiraling polyphase electrodes for electrostatic chuck | Chun Wang Chan, Yan Liu | 2022-08-16 |
| 11309207 | Grounding mechanism for multi-layer for electrostatic chuck, and related methods | Steven Donnell, Chun Wang Chan, Yan Liu | 2022-04-19 |