Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11355345 | Method for preventing line bending during metal fill process | Adam Jandl, Sema Ermez, Lawrence Schloss, Sanjay Gopinath, Michal Danek +2 more | 2022-06-07 |
| 11225712 | Atomic layer deposition of tungsten for enhanced fill and reduced substrate attack | Joshua Collins, Hanna Bamnolker, Kapil Sawlani | 2022-01-18 |