Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532509 | Selective hybrid capping layer for metal gates of transistors | Chung-Chiang Wu, Kuo-Chan Huang, Pin-Hsuan Yeh, Wei-Chin Lee, Hsien-Ming Lee +2 more | 2022-12-20 |
| 11338449 | Methods and systems for electroadhesion-based manipulation in manufacturing | Harsha Prahlad, Richard J. Casler, Susan Kim, Matthew Leettola, Jon Smith +11 more | 2022-05-24 |
| 11302818 | Gate resistance reduction through low-resistivity conductive layer | Chung-Chiang Wu, Kuo-Chan Huang, Hung-Chin Chung, Hsien-Ming Lee, Chien-Hao Chen | 2022-04-12 |