Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11443970 | Methods of forming a package substrate | Manohar S. Konchady, Tao Wu, Wei-Lun Kane Jen, Yi Li | 2022-09-13 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11443970 | Methods of forming a package substrate | Manohar S. Konchady, Tao Wu, Wei-Lun Kane Jen, Yi Li | 2022-09-13 |