Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11482485 | Semiconductor structure | Chun-Hung Chen | 2022-10-25 |
| 11450633 | Package structure of semiconductor device with improved bonding between the substrates | Chung-Hsing Kuo, Hui-Ling Chen | 2022-09-20 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11482485 | Semiconductor structure | Chun-Hung Chen | 2022-10-25 |
| 11450633 | Package structure of semiconductor device with improved bonding between the substrates | Chung-Hsing Kuo, Hui-Ling Chen | 2022-09-20 |