Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450633 | Package structure of semiconductor device with improved bonding between the substrates | Ming-Tse Lin, Chung-Hsing Kuo | 2022-09-20 |
| 11354210 | Host, system and method for facilitating debugging in booting | Yen-Hui Chang | 2022-06-07 |
| 11355431 | Semiconductor structure | Chien-Ming Lai, Zhi-Rui Sheng | 2022-06-07 |
| 11342465 | Method of forming oxide semiconductor field effect transistor | Chien-Ming Lai, Yen-Chen Chen, Jen-Po Huang, Sheng-Yao Huang, Qinggang Xing +3 more | 2022-05-24 |