Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450633 | Package structure of semiconductor device with improved bonding between the substrates | Ming-Tse Lin, Hui-Ling Chen | 2022-09-20 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450633 | Package structure of semiconductor device with improved bonding between the substrates | Ming-Tse Lin, Hui-Ling Chen | 2022-09-20 |