Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495548 | Semiconductor package having thin substrate and method of making the same | Long Wang, Madhur Bobde, Bo-Wei Chen, Shuhua Zhou | 2022-11-08 |
| 11437297 | Moderated deformation of a vapor chamber to match a shape of a heat source | Guoliang Ying, Guangying Zhang, Xinglong Xu, Wei-Cheng Liao, Fangbo ZHU | 2022-09-06 |