Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495548 | Semiconductor package having thin substrate and method of making the same | Jun Lu, Long Wang, Madhur Bobde, Bo-Wei Chen | 2022-11-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495548 | Semiconductor package having thin substrate and method of making the same | Jun Lu, Long Wang, Madhur Bobde, Bo-Wei Chen | 2022-11-08 |