Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538933 | Schottky diode integrated into superjunction power MOSFETs | Yi Su | 2022-12-27 |
| 11508819 | Method for forming super-junction corner and termination structure with graded sidewalls | Karthik Padmanabhan, Lingpeng Guan | 2022-11-22 |
| 11495548 | Semiconductor package having thin substrate and method of making the same | Jun Lu, Long Wang, Bo-Wei Chen, Shuhua Zhou | 2022-11-08 |
| 11430762 | Method for semi-wafer level packaging | Yan Xun Xue, Long Wang, Bo-Wei Chen | 2022-08-30 |
| 11417648 | Intelligent power module containing IGBT and super-junction MOSFET | Bum Seok Suh, Zhiqiang Niu, Junho Lee, Xiaojing Xu, Zhaorong Zhuang | 2022-08-16 |
| 11342410 | Improving IGBT light load efficiency | Lingpeng Guan, Karthik Padmanabhan, Bum Seok Suh | 2022-05-24 |
| 11245016 | Silicon carbide trench semiconductor device | David Sheridan, Vipindas Pala | 2022-02-08 |