Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11464139 | Conformable heat sink interface with a high thermal conductivity | Kelly Lofgreen, Todd Coons, Christopher Wade Ackerman, Edvin Cetegen, Yang Jiao +2 more | 2022-10-04 |