Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11410894 | Polygon integrated circuit (IC) packaging | Charles L. Arvin, Richard F. Indyk, Bhupender Singh, Shidong Li | 2022-08-09 |
JC
Jon A. Casey
Overall (2022): #399,751 of 548,613Top 75%
1
Patents 2022