Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11456281 | Architecture and processes to enable high capacity memory packages through memory die stacking | Yi Li, Zhiguo Qian, Prasad Ramanathan, Saikumar Jayaraman, Kemal Aygun +3 more | 2022-09-27 |