Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11485861 | Method for applying thermally conductive composition on electronic components | Peng Wei, Yan Zheng, Dorab Bhagwagar, Debo Hong, Danhuan Ma +1 more | 2022-11-01 |
| 11338563 | Multilayer films and laminates containing slip agents | Andong Liu, Hongyu Chen, Jianping Pan, Xiao Bing Yun, Thomas Allgeuer +3 more | 2022-05-24 |