Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11485861 | Method for applying thermally conductive composition on electronic components | Fengyi Su, Yan Zheng, Dorab Bhagwagar, Debo Hong, Danhuan Ma +1 more | 2022-11-01 |
| 11490237 | Bluetooth connection method and device | Xingpeng Zhao, Wenhua Fan, Yinzheng Zhou, Xiangyu Wang, Mingfang Pan +2 more | 2022-11-01 |
| 11324118 | Circuit board and connector | — | 2022-05-03 |
| 11272621 | Substrate and method for fabricating flexible electronic device and rigid substrate | Zihong Liu, Xiaojun Yu | 2022-03-08 |