Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11485861 | Method for applying thermally conductive composition on electronic components | Peng Wei, Fengyi Su, Dorab Bhagwagar, Debo Hong, Danhuan Ma +1 more | 2022-11-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11485861 | Method for applying thermally conductive composition on electronic components | Peng Wei, Fengyi Su, Dorab Bhagwagar, Debo Hong, Danhuan Ma +1 more | 2022-11-01 |