Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11309216 | Large grain copper interconnect lines for MRAM | Alexander Reznicek, Oleg Gluschenkov, Yasir Sulehria | 2022-04-19 |
| 11302637 | Interconnects including dual-metal vias | Balasubramanian S. Pranatharthi Haran, Takeshi Nogami | 2022-04-12 |