Issued Patents 2022
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11506577 | Automated system and method for advancing tape to transport cut tissue sections | Mark Fasciano, Partha P. Mitra | 2022-11-22 |
| 11488883 | Semiconductor device package having thermally conductive layers for heat dissipation | Yazhou Zhang, Jiandi Du, Hope Chiu, Fen Yu, Ada Shen +2 more | 2022-11-01 |
| 11467071 | Facing and quality control in microtomy | Partha P. Mitra, Charles R. Cantor, Baris Yagci, David Kleinfeld, Steven W. Smith | 2022-10-11 |
| 11456279 | Integrated electronic element module, semiconductor package, and method for fabricating the same | Chin-Tien Chiu, Xuyi Yang, Qi Deng | 2022-09-27 |
| D963565 | Charger for electric vehicle | — | 2022-09-13 |
| 11428609 | Automated tissue section transfer system with high throughput | Baris Yagci, Eric Feinstein, Partha P. Mitra, Janak Sewkarran, Robert Shusko | 2022-08-30 |
| 11422474 | Dynamic illumination method based on scan exposure machine | Yuyang Bian, Lulu LAI, Xiaobo Guo | 2022-08-23 |
| 11351710 | Multilayered structures and uses thereof in security markings | Eric Baer, Andy Olah, Zhenpeng Li, Michael Hore | 2022-06-07 |
| 11316682 | Method for implementation of post-quantum key exchange protocol and application thereof | Dongsheng Liu, Xingjie Liu, Zilong Liu, Ang Hu, Wending Zhao +2 more | 2022-04-26 |
| 11302673 | Semiconductor device including vertically stacked semiconductor dies | Xuyi Yang, Chin-Tien Chiu | 2022-04-12 |
| 11276669 | High capacity semiconductor device including bifurcated memory module | Xuyi Yang, Shineng Ma, Chin-Tien Chiu | 2022-03-15 |
| 11257785 | Multi-module integrated interposer and semiconductor device formed therefrom | Chin-Tien Chiu, Xuyi Yang, Yazhou Zhang | 2022-02-22 |