Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508644 | Semiconductor device package having thermally conductive pathways | Yazhou Zhang, Kent Yang, Hope Chiu | 2022-11-22 |
| 11425817 | Side contact pads for high-speed memory card | Xuyi Yang, Chih-Chin Liao, Chin-Tien Chiu, JinXiang Huang | 2022-08-23 |
| 11355485 | Semiconductor die and semiconductor package | Yazhou Zhang, Chin-Tien Chiu | 2022-06-07 |
| 11276669 | High capacity semiconductor device including bifurcated memory module | Xuyi Yang, Cong Zhang, Chin-Tien Chiu | 2022-03-15 |