Issued Patents 2022
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11456279 | Integrated electronic element module, semiconductor package, and method for fabricating the same | Cong Zhang, Xuyi Yang, Qi Deng | 2022-09-27 |
| 11444001 | Thermoelectric semiconductor device and method of making same | Jiandi Du, Yazhou Zhang, Binbin Zheng, Sundarraj Chandran, Wenbin Qu | 2022-09-13 |
| 11425817 | Side contact pads for high-speed memory card | Shineng Ma, Xuyi Yang, Chih-Chin Liao, JinXiang Huang | 2022-08-23 |
| 11393735 | Semiconductor device including reinforced corner supports | Yangming Liu, Ning Ye | 2022-07-19 |
| 11355485 | Semiconductor die and semiconductor package | Yazhou Zhang, Shineng Ma | 2022-06-07 |
| 11302673 | Semiconductor device including vertically stacked semiconductor dies | Xuyi Yang, Cong Zhang | 2022-04-12 |
| 11276669 | High capacity semiconductor device including bifurcated memory module | Xuyi Yang, Shineng Ma, Cong Zhang | 2022-03-15 |
| 11257785 | Multi-module integrated interposer and semiconductor device formed therefrom | Cong Zhang, Xuyi Yang, Yazhou Zhang | 2022-02-22 |