Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11437276 | Packaged dies with metal outer layers extending from die back sides toward die front sides | Jaynal A. Molla, Lakshminarayan Viswanathan, David F. Abdo, Fernando A. Santos | 2022-09-06 |
| 11387373 | Low drain-source on resistance semiconductor component and method of fabrication | Jeffrey Lynn Weibrecht, Jeremy Kramer, Elijah Blue Foster, Melissa Picard | 2022-07-12 |