Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11437276 | Packaged dies with metal outer layers extending from die back sides toward die front sides | Jaynal A. Molla, Lakshminarayan Viswanathan, David F. Abdo, Colby Greg Rampley | 2022-09-06 |
| 11342275 | Leadless power amplifier packages including topside terminations and methods for the fabrication thereof | Yun Wei, Lakshminarayan Viswanathan, Scott D. Marshall | 2022-05-24 |
| 11343919 | Packaged electronic devices with top terminations | Audel A. Sanchez, Lakshminarayan Viswanathan, Jerry L. White | 2022-05-24 |