Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11437276 | Packaged dies with metal outer layers extending from die back sides toward die front sides | Jaynal A. Molla, Lakshminarayan Viswanathan, Colby Greg Rampley, Fernando A. Santos | 2022-09-06 |