Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462454 | Semiconductor package comprising heat spreader and manufacturing method thereof | YUEH-MING TUNG, Jung-Wei Chen, JIAN-DE LEU, GUAN-LIN PAN | 2022-10-04 |
| 11462485 | Electronic package including electromagnetic shielding structure and method of manufacture | YUEH-MING TUNG, Jung-Wei Chen, Ying Li, Ping-Hua Chu | 2022-10-04 |
| 11426793 | Method of fabricating high-power module | In-Gann Chen, Hung-Cheng Chen, Steve Lien-Chung Hsu, Chang-Shu Kuo | 2022-08-30 |
| 11355356 | Manufacturing method of semiconductor package comprising heat spreader | YUEH-MING TUNG, Jung-Wei Chen, JIAN-DE LEU, GUAN-LIN PAN | 2022-06-07 |
| 11215399 | High temperature reaction system | In-Gann Chen, Shih-Hsien Liu, Ke-miao LU, Hao-Hsun Chang | 2022-01-04 |