Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462454 | Semiconductor package comprising heat spreader and manufacturing method thereof | Chia-Ming Yang, Jung-Wei Chen, JIAN-DE LEU, GUAN-LIN PAN | 2022-10-04 |
| 11462485 | Electronic package including electromagnetic shielding structure and method of manufacture | Chia-Ming Yang, Jung-Wei Chen, Ying Li, Ping-Hua Chu | 2022-10-04 |
| 11355356 | Manufacturing method of semiconductor package comprising heat spreader | Chia-Ming Yang, Jung-Wei Chen, JIAN-DE LEU, GUAN-LIN PAN | 2022-06-07 |