Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462454 | Semiconductor package comprising heat spreader and manufacturing method thereof | YUEH-MING TUNG, Chia-Ming Yang, Jung-Wei Chen, JIAN-DE LEU | 2022-10-04 |
| 11355356 | Manufacturing method of semiconductor package comprising heat spreader | YUEH-MING TUNG, Chia-Ming Yang, Jung-Wei Chen, JIAN-DE LEU | 2022-06-07 |