Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11444011 | Semiconductor package with leadframe interconnection structure | Andreas Kucher, Chia-Yen Lee, Shao Ping Wan | 2022-09-13 |
| 11355460 | Molded semiconductor package with high voltage isolation | Shao Ping Wan, Eric Brion Acquitan, Dexter Reynoso, Jürgen Schredl | 2022-06-07 |