Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11444011 | Semiconductor package with leadframe interconnection structure | Woon Yik Yong, Andreas Kucher, Shao Ping Wan | 2022-09-13 |
CL
Chia-Yen Lee
Overall (2022): #498,228 of 548,613Top 95%
1
Patents 2022