Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11355460 | Molded semiconductor package with high voltage isolation | Shao Ping Wan, Eric Brion Acquitan, Dexter Reynoso, Woon Yik Yong | 2022-06-07 |
JS
Jürgen Schredl
Overall (2022): #385,396 of 548,613Top 75%
1
Patents 2022