Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538842 | Chip scale package structures | Tao-Chih Chang | 2022-12-27 |
| 11424190 | Multi-chip package and manufacture method thereof | Chao-Jung Chen, Sheng-Tsai Wu, Shin-Yi Huang, Ang-Ying Lin, Tzu-Hsuan Ni +1 more | 2022-08-23 |
| 11355472 | Package structure and method for connecting components | Tao-Chih Chang, Wei-Chung Lo | 2022-06-07 |
| 11326836 | Vapor/liquid condensation system | Chih-Peng Chen | 2022-05-10 |
| 11258378 | Piezoelectric apparatus for motorization | Chih-Kung Lee, Yu-Hsiang Hsu, Wen-Jong Wu, Tsung-Yu Chu | 2022-02-22 |
| 11251174 | Image sensor package and manufacturing method thereof | Sheng-Tsai Wu, Yuan-Yin Lo, Ang-Ying Lin, Tzu-Hsuan Ni, Chao-Jung Chen +1 more | 2022-02-15 |
| 11239168 | Chip package structure | Hsin-Han Lin, Tao-Chih Chang | 2022-02-01 |