Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11424190 | Multi-chip package and manufacture method thereof | Chao-Jung Chen, Yu-Min Lin, Sheng-Tsai Wu, Ang-Ying Lin, Tzu-Hsuan Ni +1 more | 2022-08-23 |
| 11251174 | Image sensor package and manufacturing method thereof | Sheng-Tsai Wu, Yu-Min Lin, Yuan-Yin Lo, Ang-Ying Lin, Tzu-Hsuan Ni +1 more | 2022-02-15 |